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2-pin leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 diode SOD70 2-pin TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 16 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 44 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 8 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm HVSON, 8 Pin (https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=34), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Molex SPOX Connector System, 87437-1443, 14 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 3.5, Wuerth electronics 9774070243 (https://katalog.we-online.de/em/datasheet/9774070243.pdf), generated with kicad-footprint-generator Fuse SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.vishay.com/docs/20056/crcw01005e3.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-150-02-xx-DV-TE, 50 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0290, 29 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ108178.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad TSSOP HTSSOP 0.65 thermal pad LQFP.

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