Labels Milestones
Back16x16x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 28 leads; body width 5.3 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3.
- Normal 0.0464246 0.0868544 0.995139.
- 0.174179 -0.420511 0.890411 vertex 3.23535 0.378418.
- Normal -3.544499e-15 -2.713367e-15 1.000000e+00 facet normal.
- 0.990927 0.134403 facet normal.