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Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size.

• 0.279012 0.0846382 0.95655 vertex 3.09018.
• -0.0816537 0.993332 vertex -4.29176 -4.58792 7.81747 facet.

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