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8 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-92 leads molded, wide, drill 0.75mm, handsoldering variant with enlarged pads (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-4, Vertical, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Horizontal RM 5.08mm TO-126-2, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-247-2, Horizontal, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 1.7mm IIPAK I2PAK TO-262-3, Vertical, RM 2.54mm, staggered type-2 TO-220F-15, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical 2.54mm Pitch Multiwatt 8 TO-220-9, Vertical, RM 1.27mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 10.95mm SOT-93 TO-218-3, Horizontal, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Vertical RM 1.7mm PentawattF- MultiwattF-5 staggered type-1 TO-220F-9 Vertical RM 1.7mm IIPAK I2PAK TO-262-5, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Horizontal RM 1.7mm staggered type-1 TO-220F-11, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220F-11, Vertical, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-2 Horizontal RM 1.7mm IIPAK I2PAK TO-264-2, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL ZIF 7.62mm 300mil 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x4.1mm DIP Switch SPST Slide 7.62mm 300mil SMDSocket SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 4x-dip-switch SPST Copal_CHS-04B, Slide, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 8-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing.

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