Labels Milestones
BackBGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R-78B-2.0, SIP-3, pitch 2.54mm, hole diameter 0.7mm, length 6.5mm, width 1.8mm solder Pin_ with flat fork, hole diameter 2.0mm THT pad as test point, loop diameter 3.8mm, hole diameter 2.5mm Resistor, Axial_DIN0207 series, Axial, Vertical, pin pitch=7.62mm, , length*diameter=12.8*5.8mm^2, Fastron, HBCC, http://www.fastrongroup.com/image-show/18/HBCC.pdf?type=Complete-DataSheet&productType=series Inductor Axial series Axial Vertical pin pitch 5.08mm length 13mm diameter 4.5mm Fastron MECC Inductor, Axial series, Axial, Horizontal, pin pitch=20.32mm, , length*diameter=16*7.5mm^2, Fastron, XHBCC, http://www.fastrongroup.com/image-show/26/XHBCC.pdf?type=Complete-DataSheet&productType=series Inductor Axial series Axial Horizontal pin pitch 7.62mm length 9mm width 2.5mm Capacitor C, Rect series, Radial, pin pitch=22.90mm, , diameter=25.4mm, Vishay, TJ5, BigPads, http://www.vishay.com/docs/34079/tj.pdf L_Toroid Horizontal series Radial pin pitch 15.00mm length 16.5mm width 8.7mm Capacitor C.
- Normal 6.404052e-01 7.680372e-01 1.329459e-04 vertex -9.293340e+01 1.045515e+02.
- HiLink, HLK-10Mxx, THT, http://h.hlktech.com/download/ACDC%E7%94%B5%E6%BA%90%E6%A8%A1%E5%9D%9710W%E7%B3%BB%E5%88%97/1/%E6%B5%B7%E5%87%8C%E7%A7%9110W%E7%B3%BB%E5%88%97%E7%94%B5%E6%BA%90%E6%A8%A1%E5%9D%97%E8%A7%84%E6%A0%BC%E4%B9%A6V1.8.pdf ACDC-Converter.
- Http://www.txccorp.com/download/products/osc/7C_o.pdf, 5.0x3.2mm^2 package Miniature.