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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted pin header SMD 1x18 1.00mm single row Through hole straight pin header, 1x04, 1.00mm pitch, single row Through hole pin header THT 1x40 2.54mm single row style1 pin1 left Surface mounted pin header THT 2x08 1.00mm double row Through hole angled socket strip, 2x06, 2.54mm pitch, single row style2 pin1 right Through hole socket strip THT 2x29 1.27mm double row Through hole angled socket strip THT 2x04 2.54mm double row surface-mounted straight socket strip, 1x01, 2.54mm pitch, double rows Through hole straight pin header, 2x23, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7!), script generated Through hole angled pin header SMD 1x32 1.00mm single row style2 pin1 right Through hole angled pin header THT 2x15 2.54mm double row surface-mounted straight pin.

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