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Ball, 4x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7!), script generated Through hole pin header THT 2x37 1.00mm double row surface-mounted straight pin header, 1x04, 1.27mm pitch, 4.0mm pin length, double.

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