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14-lead dip package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 32-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing.

• Copy The MIT License Copyright (c.
• MSTBV_2,5/6-GF; number of pins: 03; pin pitch: 5.08mm.
• -6.45393 6.1731 facet normal -0.831463 -0.555581 0.

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