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Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 5, row spacing 8.61 mm.

• 2 Latest commits for file Images/adsr.png.
• Instruments, QFM MOF0009A, 6x8x2mm.

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