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Https://wiki.wemos.cc/products:d1:d1_mini, https://c1.staticflickr.com/1/734/31400410271_f278b087db_z.jpg DIN rail adapter universal three M3 clearance holes Mounting Hole 6mm, no annular m4 din965 Mounting Hole 6.4mm, M6, ISO14580 mounting hole 2.5mm no annular m3 iso7380 Mounting Hole 2.2mm, no annular, M2.5, ISO7380 mounting hole 5.3mm no annular mounting hole 4.3x6.2mm m4 Mounting Hole 3.2mm, M3, ISO7380 mounting hole 3.2mm no annular m2.5 Mounting Hole 2mm, no annular m3 iso7380 Mounting Hole 5.3mm, M5, DIN965 mounting hole 4.3mm no annular Mounting Hole 3.2mm, no annular, M6, DIN965 mounting hole 2.2mm no annular m5 iso14580 Mounting Hole 3.2mm, no annular, M3, ISO14580 mounting hole 3.2mm m3 iso7380 Mounting Hole 2.2mm, no annular, M4, ISO7380 mounting hole 4.3mm no annular m4 iso14580 Mounting Hole 6.4mm, no annular, M3, ISO7380 mounting hole 2.2mm m2 din965 Mounting Hole 5.3mm, no annular, M2, ISO14580 mounting hole 2.2mm no annular mounting hole 4.3mm no annular m5 iso14580 Mounting Hole 4.3mm, no annular, M3, DIN965 mounting hole 4.3mm m4 Mounting Hole 4.3mm, M4, ISO7380 mounting hole 3.5mm no annular Mounting Hole 2.7mm, no annular, M2, ISO7380 mounting hole 2.2mm no annular m2 din965 Mounting Hole 2.2mm, no annular, M6, ISO7380 mounting hole 8.4mm m8 Mounting Hardware, inside through hole 2.25mm, height 4.5, Wuerth electronics 9771070360 (https://katalog.we-online.com/em/datasheet/9771070360.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-05P-1.25DS, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py FE Package; 16-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic Small Outline (ST)-4.4 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 7.62 mm (300 mils), body size 10.8x9.18mm 3x-dip-switch SPST CTS_Series194-3MSTN, Piano, row spacing 9.53.

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