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Back3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole socket strip THT 1x23 2.00mm single row Through hole angled pin header, 1x06, 2.54mm pitch, double rows Surface mounted socket strip SMD 1x34 2.00mm single row Through hole angled socket strip, 2x41, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight socket strip, 2x32, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header SMD 2x14 2.54mm double row Through hole socket strip SMD 1x35 2.00mm single row (from Kicad 4.0.7.
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