Labels Milestones
BackPin (https://www.nxp.com/docs/en/package-information/98ASA00694D.pdf DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CE.PDF DD.
- Grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad.
- Connector, FF0871SA1, 71 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ108178.pdf), generated.
- Wuerth, WE-CMB, Bauform XXL, Lodestone Pacific, 64.51mm diameter.