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At 90° to minimize capacitance between traces vias connect through the power safety block and into any non-high-impedence connections; that is, fat traces to chip power, but not as efficient as a result of switching to pcb-mounted panel components version

main VCA/Panels/dual_vca.scad 393 lines $fn=FN; footprint_depth = .25; //non-printing, barely-visible outline of component footprints printer_z_fix = 0.25; // for spherical.

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