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0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 14-Lead.

• (end 174.9025 119.65 (end 171.370001.
• 0.0974275 -0.989344 0.108195 facet normal 0.778622 0.416181 0.469619.
• -0.0220967 -0.0968094 -0.995058 facet normal -0.995182.

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