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Spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 2.54mm staggered type-1 TO-220F-11, Vertical, RM 0.9mm, staggered type-2 TO-220-5, Vertical, RM 1.27mm, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-7 Vertical RM 2.54mm staggered type-2 TO-220F-15 Vertical RM 0.97mm Multiwatt-9 staggered type-2 TO-220-9, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Horizontal RM 2.54mm TO-220F-4, Vertical, RM 1.7mm, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 3.81mm TO-264-5, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 1.27mm Multiwatt-7 staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 1.7mm.

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