3
1
Back

Stencil (https://www.infineon.com/dgdl/ir4302.pdf?fileId=5546d462533600a4015355d602a9181d, https://www.infineon.com/dgdl/Infineon-AN1170-AN-v05_00-EN.pdf?fileId=5546d462533600a40153559ac3e51134 14-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic Micro Small Outline (SO) - Wide, 7.50 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (https://www.ti.com/lit/pdf/qfnd619), generated with kicad-footprint-generator connector wire 0.25sqmm strain-relief Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Molex Sabre Power Connector.

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