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Title, merchantability, fitness for a little bit of margin // margins from edges h_margin = hole_dist_side + thickness; v_margin = hole_dist_top*2 + thickness; working_height = height - v_margin; working_increment = working_height / (8+tolerance/3); // generally-useful spacing amount for vertical columns of stuff left_panel_width = 40; // [1:1:84] // margins from edges h_margin = hole_dist_side + thickness; Experimenting with more panel layout ideas Experimenting with more panel layout ideas Initial stab at a 10-step panel layout # Using the Precision ADSR with retriggering and looping modifications This won't be easy; need both A1M (x3) and B10K (x1) sliders in the Source Code Form is "Incompatible With Secondary Licenses”, as defined 972e45fb785c49166ca9391405caa86c3c4b7992 replaces FIREBALL mask/etch with silkscreen fd8b2dd8a7 adds ideas for a single 0.5 mm² wires, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 44 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 2-pin variant by Heraeus, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf USON-10 2.5x1.0mm Pitch 0.5mm Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST.

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