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BackPackage SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 24 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 28 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf#page=23), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.127 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.5mm, size 18.2x7mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND.
- 9.993546e-01 2.758832e-03 3.581708e-02 vertex -9.054786e+01 1.005513e+02 1.080023e+01.
- Header hdr horizontal right-angle shrouded fully-shrounded 440054-2 2-440054-2.