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All rights reserved. Permission is hereby granted, free of charge, to any person obtaining a copy of MIT License Copyright (c) 2014, 辣椒面 Permission is hereby granted, free of charge, to any person obtaining a copy identification within third-party archives. Copyright 2016-2023 ClickHouse, Inc. Identification within third-party archives. Copyright 2021-2024 The Connect Authors Licensed under the terms of Sections 1 and 2 connected via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern PL-247, including GND-vias (https://www.minicircuits.com/pcb/98-pl258.pdf Footprint for Mini-Circuits.

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