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Http://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/f32pm25.pdf TSOP I, 32 pins, 18.4x8mm body (https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf TSOP-I, 56 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EB), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1221 (alternative finishes: 43045-220x), 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 8-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 1956f.pdf TSSOP, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf), generated.

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