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4x4, 0.5P; CASE 506CM (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 1x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 5.9 mm (232 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST Omron_A6H-6101, Slide, row spacing 15.24 mm (600 mils), Socket 42-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 10.8x29.5mm 11x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package.

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