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Force socket, through-hole, row spacing 11.48 mm (451 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing.

• -0.773016 0 facet normal -0.956916.
• B34B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48.
• MSTBVA_2,5/15-G-5,08; number of pins: 13.

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