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Style M238 TO-252 / DPAK SMD package, http://www.onsemi.com/pub/Collateral/ENA2192-D.PDF Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin 2x2mm Pitch 0.5mm Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm HVSON, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-8/CP_8_13.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/drv8801.pdf#page=31 MO-220 variation VJJD-2), generated with kicad-footprint-generator JST XH series connector, 502585-0270 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B38B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator JST SUR series connector, 64800911622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/ LFBGA-100, 10x10 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted socket strip THT 2x39 1.27mm double row surface-mounted straight pin header, 2x01, 2.00mm pitch, 4.2mm pin length, single row Surface mounted socket strip SMD 1x37 1.27mm single row style2 pin1 right Through hole straight pin header, 1x13, 1.00mm pitch, double rows Surface mounted socket strip THT 2x04 2.00mm double row Through hole angled socket strip THT 1x13 1.00mm single row Through hole pin header SMD 2x33 2.00mm double row surface-mounted straight socket strip, 1x29, 2.00mm pitch, 6.35mm socket length, single row Through hole pin header THT 2x01 2.00mm double row surface-mounted straight socket strip, 2x18, 2.00mm pitch, single row style2 pin1 right Through hole straight socket strip, 1x33, 2.00mm pitch, 6.35mm socket length, double rows Through hole angled socket strip THT 1x24 2.54mm single row style2 pin1 right Through hole IDC header, 2x17, 1.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 1x26 2.54mm single row style2 pin1 right Through hole.

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