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Below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R5xxxPA, SIP-12, pitch 2.54mm, size 15.7x6.2mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated with , script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT single screw terminal block Metz Connect Type011_RT05502HBWC, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-169XCGDK(Ver.9B).pdf LED_Rectangular Rectangular Rectangular size 5.0x2.0mm^2 z-position of LED center 3.0mm 2 pins diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 9.0mm 2 pins diameter 3.0mm 2 pins LED, diameter 3.0mm z-position of LED center 3.0mm, 2 pins, diameter 5.0mm z-position of LED center 2.0mm 2 pins LED_Rectangular Rectangular Rectangular size 3.9x1.9mm^2, 2 pins, pitch 5mm, size 30x10.5mm^2, drill diamater 1.3mm, pad diameter 1.4mm, length 8.5mm, width 2.8mm, e.g. Ettinger 13.13.865, https://katalog.ettinger.de/#p=434 solder Pin_ diameter 1.3mm, wire diameter 1.0mm test point THT pad as test Point, diameter 2.0mm, hole.

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