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SmallPads 40-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x11.72mm 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 11.48 mm (451 mils 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 5x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 2x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD DIP DIL PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier 4-lead round diode bridge Vishay KBL rectifier diode bridge Vishay KBL rectifier diode bridge SMD diode bridge Vishay KBL rectifier package, 5.08mm pitch, single row Surface mounted socket strip SMD 1x36 2.00mm single row Surface mounted socket strip THT 2x40 2.00mm double row Through hole angled pin header, 2x23, 2.54mm pitch, 8.51mm socket length, single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x10, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted pin header THT 1x25 2.00mm single row style2 pin1 right Through hole Samtec HPM power header series 11.94mm post length, 1x19, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x10, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x35, 1.00mm pitch.

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