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Https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x29 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x16 2.54mm single row Through hole IDC header, 2x05, 2.54mm pitch, double rows Surface mounted pin header THT 1x36 1.00mm single row Through hole vertical IDC header THT 1x18 1.27mm single row Through hole IDC header, 2x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x08, 2.54mm pitch, single row Through hole straight socket strip, 1x30, 1.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x08 1.27mm single row Surface mounted socket strip SMD 2x20 1.00mm double.

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