Labels Milestones
Back0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with.
- 1.195953e-03 4.131396e-01 facet normal 0.161939 -0.264267.
- 1.127522e+01 vertex -1.078235e+02 9.665134e+01.
- Coaxial Connector 50 ohms Female Jack Vertical THT.