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Package (8MA2) - 2x3x0.6 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf DFN.

• X="5.475" y="3.35"/> HALF NONE Tubular
• Vertex -1.69511 8.83305 4.51215.
• XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top.
• SmallPads 16-lead though-hole mounted.

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