Labels Milestones

Back

Sensor Infineon, IP57, XENSIV, LGA-5, https://www.infineon.com/dgdl/Infineon-IM73A135-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017fadec36b84500 MEMS Microphone LGA Dust Water TDK InvenSense MEMS.

• 2.42184 2.42184 18.1498 facet.
• THT 2x25 1.27mm double row Through hole.
• Molex CLIK-Mate top entry JST NV.
• Width 8.0mm Capacitor C, Rect.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects