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2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.8mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 8x8mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3.277x3.109mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header THT 1x37 1.00mm single row Through hole angled pin header, 2x37, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 1x31 2.54mm single row Surface mounted pin header THT 2x38 2.54mm double row surface-mounted straight socket strip, 1x36, 2.00mm pitch, 4.2mm pin length, single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x36 1.27mm double row Through hole horizontal IDC header THT 2x10 1.27mm double row Through hole straight socket strip, 2x27, 2.00mm pitch, single row style2 pin1 right Through hole angled socket strip THT 1x34 2.00mm single row Through hole angled pin header, 1x31, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x23, 2.00mm pitch, single row Through hole socket strip THT 1x40 2.54mm single row style1 pin1 left Surface mounted socket strip THT 1x24 2.00mm single row Surface mounted pin header SMD 1x20 2.00mm single row Through hole straight socket strip, 2x19, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header, 2x08, 1.00mm pitch, single row Through hole angled pin header THT 2x29 1.00mm double row Through hole pin header THT 2x01 2.00mm double row surface-mounted straight pin header, 2x27, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x25 2.00mm single row Surface mounted pin header THT 1x21 2.54mm single row Through hole.

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