synth_tools

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VFBGA-100, 10x10, 7x7mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3.294x3.258mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 8x8mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf E-Switch slide switch, EG series, SPDT, right angle, http://spec_sheets.e-switch.com/specs/P040042.pdf E-Switch sub miniature slide switch, EG series, SPDT, https://www.ckswitches.com/media/1428/os.pdf tactile switch SPST LED OFF-ON D Single Pole Single Throw (SPST) switch, small symbol D 4x DIP Switch, Single Pole Single Throw (SPST) switch, small symbol D 10x DIP Switch, Single Pole Single Throw (SPST) switch, small symbol D 12x DIP Switch, Single Pole Single Throw (SPST) switch, temperature dependent Schematics/SynthMages.pretty/Switch.lib Normal file Unescape Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Panel_Dual_Slotted_Mounting_Hole_NPTH.kicad_mod Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/CP_Radial_D6.3mm_P2.50mm.kicad_mod Normal file View File 3D Printing/Cases/Eurorack 2-Row/rail.stl Executable file View File 3D Printing/Cases/Eurorack Modular Case/EuroRack_Case_26.stl Executable file View File 3D Printing/Cases/Eurorack Modular Case/EuroRack_Case_Power.stl Executable file View File 3D Printing/Pot_Knobs/FS_PotiKnob_d6D12h9.stl Executable file View File 3D Printing/Cases/Eurorack Modular Case/DSC03766.JPG Executable file Unescape REP: repique CAX: caixa MSD: mid surdo (sometimes MS1, MS2, etc.

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