Labels Milestones
BackST WLCSP-156, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A.
- -9.901835e-01 -0.000000e+00 facet normal -3.469823e-16 -4.151400e-15 1.000000e+00.
- 6-lead surface-mounted (SMD) DIP package.