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Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf Altera BGA-256 M256 MBGA BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf Altera UBGA U169 BGA-169 BGA-200, 14.5x10.0mm, 200 Ball, 12x22 Layout, 0.8x0.65mm Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf Altera BGA-256 M256 MBGA BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 24 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row style2 pin1 right Through hole angled pin header, 2x36, 2.00mm pitch, double rows Through hole angled pin header, 2x13, 2.00mm pitch, double rows Through hole angled socket strip SMD 1x37 1.00mm single row Surface mounted socket strip SMD 1x34 2.54mm single row style2 pin1 right Through hole straight socket strip, 1x26, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x27 1.00mm single row Through hole socket strip THT 2x41 1.27mm double row Through hole straight socket strip, 2x02, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x21 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x18 2.54mm double row Through hole angled socket strip, 2x03, 2.54mm pitch, 8.51mm socket length, double rows Through hole straight Samtec HPM power header series 3.81mm post length, 1x05, 5.08mm pitch, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/b40c3700.pdf Diotec rectifier diode bridge 9.0mm 8.85mm WOB pitch 5.0mm 4-lead round diode bridge Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package for diode bridges, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/MCP6V66-Family-Data-Sheet-DS20006266A.pdf#page=35), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53047-0310, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-104-02-xx-DV-PE-LC, 4 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-126-02-xx-DV-PE-LC, 26 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DE Package; 14-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44.

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