synth_tools

Back

2x01 2.54mm double row surface-mounted straight pin header, 1x29, 2.54mm pitch, single row Surface mounted pin header THT 2x25 1.00mm double row Through hole angled pin header THT 1x16 2.00mm single row Through hole angled pin header THT 1x35 1.27mm single row Through hole straight pin header, 2x09, 2.00mm pitch, 4.2mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip SMD 1x40 2.00mm single row style2 pin1 right Through hole Samtec HPM power header series 11.94mm post length, 1x13, 5.08mm pitch, single row Through hole angled socket strip, 1x11, 2.54mm pitch, double rows Through hole angled pin header, 1x13, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 1x22 1.27mm single row (from Kicad 4.0.7), script generated Through hole pin header THT 1x35 2.54mm single row (from Kicad 4.0.7), script generated Through hole pin header THT 1x17 1.27mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x20, 1.27mm pitch, single row style2 pin1 right Through hole angled socket strip, 2x20, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SS)-5.30 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CM (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic VSON, 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Shrink Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 28 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm VSSOP DCU R-PDSO-G8 Pitch0.5mm VSSOP-8 3.0 x 3.0 VSSOP, 10 Pin (http://www.ti.com/lit/ds/symlink/ads1115.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times 0.15 mm² wires, basic insulation, conductor.

New Pull Request

Labels Milestones