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Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4001f.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.15 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 2mm.

RECOM, RECOM_R-78HB-0.5, SIP-3, pitch.
4.42088 -5.07598 7.17947 vertex 0.38016 -6.8561.
In object code or.
AR Path="/6091D1B4" Ref="S?" Part="1" AR Path="/607ED812/60C38349" Ref="R10.

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