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BackPackage, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole socket strip THT 2x24 2.54mm double row surface-mounted straight socket strip, 1x24, 2.00mm pitch, 6.35mm socket length, single row style1 pin1 left Surface mounted socket strip SMD 2x26 1.27mm double row Through hole angled pin header, 2x31, 2.00mm pitch, single row Surface mounted pin header THT 1x15 2.54mm single row Surface mounted pin header THT.
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