Labels Milestones
BackHTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias in pads, 2 Pins.
- Diameter 0.7mm, wire diameter 1.0mm (press.
- 5.14703 0 18.8084 facet normal -0.0702817 -0.382543 0.921261.
- FFC/FPC, 200528-0100, 10 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator.
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