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BackQuad Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [HTSSOP], with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AB), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-15A example for new part number: A-41791-0003 example.
- 236-106 45Degree pitch 7.5mm size 15x10.3mm^2 drill 1.3mm.
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Assume the cost of distribution to the Licensor.