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BackPin (https://www.onsemi.com/pub/Collateral/NCN4555-D.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7812045, 20 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Lead Frame Chip Scale Package - 9x9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf HSOP.
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