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LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SN) .

• Hardware/PCB/precadsr/ao_tht.pretty/D_DO-35_SOD27_P7.62mm_Horizontal.kicad_mod Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/Jack_6.35mm_PJ_629HAN.kicad_mod Normal file.
• 6.246964e-001 vertex -4.063003e+000 7.698298e-001 2.484855e+001 facet.

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