Labels Milestones
BackSOIC SOIC-8 Infineon PG-DSO 12 pin, exposed pad, thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ACH series connector, BM10B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py.
- Thick, 2-sided copper clad fiberglass. ENIG is unnecessary.
- 505405-0770 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with.