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Don't have one of the dialhand, from the IDC through the power safety block and into any non-high-impedence connections; that is, fat traces to chip power, but not that small - C3 and C4 could use slightly larger spacing on the other Ground planes: ground planes connect to holes - these gaps reduce heat conduction during soldering ground plane Change transistor footprint to inline_wide, fix DRC ground plane Binary files /dev/null and b/Schematics/Luthers_VCO_schematic.pdf differ main synth_tools/3D Printing/Pot_Knobs/Pot Knob in Two Parts_sep.stl Executable file View File 3D Printing/Panels/HOLD PORTAL.png Normal file Unescape Hardware/Panel/precadsr_panel_al_Gerbers/precadsr_panel_al-F_Paste.gbr Normal file View File Schematics/Luthers_VCO_schematic.pdf Normal file Unescape Schematics/SynthMages.pretty/Jack_3.5mm_QingPu_WQP-PJ398SM_Vertical_CircularHoles_Socket_Centered.kicad_mod Normal file Unescape Hardware/PCB/precadsr/ao_symbols.dcm Normal file View File Schematics/Fireball.kicad_sch Normal file View File 3D Printing/Rails/36hp_outie.stl create mode 100644 Schematics/OttosIrresistableDance/OttosIrresistableDance.kicad_pro git clone git@gitlab.com:rsholmes/precadsr.git git submodule init git submodule init git submodule update Find and replace last few thin traces, fix teardrops and gnd fill Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation.

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