Labels Milestones
BackPlaced - Wide, 5.3 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 10.8x16.8mm 6x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads.
- Tag connect programming header with bottom courtyard.
- 1.6mmx1.6mm Inductor, Wuerth Elektronik, Wuerth_MAPI-2010, 2.0mmx1.6mm Inductor, Wuerth.
- Kemet-E (7360-38 Metric), IPC_7351.
- Exclusive, irrevocable and unconditional license.