Labels Milestones
BackBGA 5 0.5 YZP Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), https://wiki.wemos.cc/products:d1:d1_mini, https://c1.staticflickr.com/1/734/31400410271_f278b087db_z.jpg DIN rail adapter universal three M3 clearance holes Mounting Hole 6.4mm, no annular, M2, ISO14580 mounting hole 3.2mm no annular m5 din965 Mounting Hole 3.7mm, no annular m5 din965 Mounting Hole 3.2mm, M3, ISO14580 mounting hole 3.2mm no annular m6 iso14580 Mounting Hole 2.1mm, no annular m5 Mounting Hole 5.3mm, no annular, M5 mounting hole 4.3x6.2mm m4 Mounting Hole 3.2mm, M3, ISO7380 mounting hole 2.2mm m2 din965 Mounting Hole 2.2mm, M2, ISO14580 mounting hole 4.3mm m4 Mounting Hole.
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