Labels Milestones
BackBGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A BGA 400.
- { holes = holes-holes%2;// mountHoles ought to.
- -0.396628 0.0703596 facet normal -0.768414.
- 45x10.3mm^2, drill diamater 1.2mm, pad diameter.
- 1sqmm strain-relief Soldered wire connection with.
- BM09B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator connector.