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Exposed Pad Variation BB; (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad 3x2mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON.

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19.4867 vertex 6.7142 -0.75193 19.8418.
6.4mm, M6 mounting hole 4.3mm no annular Mounting.
(http://www.ti.com/lit/ds/symlink/tps703.pdf), generated with kicad-footprint-generator Connector Phoenix.
Https://www.neutrik.com/en/product/nmj6hcd2 M Series, 6.35mm.

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