Labels Milestones
Back3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506BU.PDF 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 48 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 28 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 12-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size 6.7x19.34mm.
- OpenWRT, industrial SoM computer, https://www.8devices.com/media/products/carambola2/downloads/carambola2-datasheet.pdf.
- 734-164 , 4 Pins per row.