Labels Milestones
Back400mil 4-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 4x-dip-switch SPST KingTek_DSHP04TS, Slide, row spacing 8.9 mm (350 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 11x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD Sub-miniature slide switch, EG series, DPDT, http://spec_sheets.e-switch.com/specs/P040047.pdf E-Switch slide switch, OS series, SPDT, https://www.e-switch.com/wp-content/uploads/2022/06/EG.pdf tactile switch, 7.3mm x 6.25mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 10x10mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 24 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC 2.54 8-Lead Plastic DFN (1.3mm x 1.2mm DFN, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (http://www.ti.com/lit/ds/symlink/drv8662.pdf#page=23), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-5191, 51 Circuits (http://www.molex.com/pdm_docs/sd/5022505191_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xx-DV-PE-LC, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator connector Molex Mini-Fit_Jr top entryplastic_peg Molex Mini-Fit Jr. Power Connectors, 42819-42XX, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770968-x, 2 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-108-02-xxx-DV-BE-A, 8 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF (T2044-5C)), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: A-41791-0016 example for new part number: 26-60-4180, 18 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 5, Wuerth electronics 9774030633 (https://katalog.we-online.com/em/datasheet/9774030633.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, S4B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105314-xx04, 2 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated.
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