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PTS645 Series 6mm Tact Switch with High Contact Reliability, Top-actuated Model, with Ground Terminal, without Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Top-actuated Model, with Ground Terminal, without Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Top-actuated Model, with Ground Terminal, with Boss SPST button tactile switch 6mm ALPS SKHH right angle smd HDMI, Micro, Type D, THT/SMD hybrid, 0.4mm pitch, 19 ckt, right angle (http://www.molex.com/pdm_docs/sd/467651301_sd.pdf hdmi micro type d right angle smd HDMI, Micro, Type D, SMD, 0.4mm pitch, 19 ckt, right angle SPDT push button (https://www.alps.com/prod/info/E/PDF/Tact/SurfaceMount/SKRT/SKRT.pdf push horizontal SPST 1P1T CK components KMR2 tactile switch SPST right angle, stacked (https://www.molex.com/content/dam/molex/molex-dot-com/products/automated/en-us/salesdrawingpdf/484/48406/484060001_sd.pdf USB 3.0 type A right angle tactile switch SPST right angle, stacked (https://www.molex.com/content/dam/molex/molex-dot-com/products/automated/en-us/salesdrawingpdf/484/48406/484060001_sd.pdf USB 3.0 type A Plug, Horizontal, http://katalog.we-online.de/em/datasheet/692112030100.pdf usb A plug horizontal Micro USB Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SS)-5.30 mm Body [TQFP] With Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Stretched Small Outline (SS)-5.30 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 14 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC 1.27 16 12 Wide 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP.

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