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BackBGA 196 0.5 CPGA196 Artix-7 BGA, 16x16 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 5, row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMD 2x-dip-switch SPST Copal_CHS-02A, Slide, row spacing.
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